  |
|
| Package |
SOIC-8 |
SOIC-16 |
| Package Out Line |
 |
 |
Package size(mm)
(LxWxT) |
4.9 X 3.9 X 1.46 |
10 X 3.9 X 1.46 |
| Lead Frame |
Material |
C194 |
C194 |
Thickness
(mm) |
0.2 |
0.2 |
Flag size
(mm) |
2.7 X 4.2 |
2.28 X 7.7 |
Max chip size(mm)
(Equipment tolerance:
｡ｾ50ｧｭ) |
2.2x 3.8 |
2.0 x 4.0 |
| Max chip thickness(mm) |
0.45 |
0.45 |
| Die chip technology |
Ag Epoxy |
Ag Epoxy |
| Mold compound |
KTMC-1020 |
KTMC-1020 |
| Tin Plating |
Composition |
Sn:Pb=90:10 |
Sn:Pb=90:10 |
Thickness
|
6.0-16.0 |
6.0-16.0 |
|
|
