  |
|
| Package |
TO-92 SIDE |
To-92 center |
| Package Out Line |
 |
 |
Package size(mm)
(LxWxT) |
4.6x4.52x3.5 |
4.6x4.52x3.5 |
| Lead Frame |
Material |
PMC 90 |
PMC 90 |
Thickness
(mm) |
0.4 |
0.4 |
Flag size
(mm) |
3.8x1.5 |
3.96x1.4 |
Max chip size(mm)
(Equipment tolerance:
｡ｾ50ｧｭ) |
2.5x1.3 |
2.5x1.2 |
| Max chip thickness(mm) |
0.45 |
0.45 |
| Die chip technology |
Eutectic
Ag epoxy |
Eutectic
Ag epoxy |
| Mold compound |
KTMC-3040NM |
KTMC-3040NM |
| Tin Plating |
Composition |
Sn:Pb=60:40 |
Sn:Pb=60:40 |
Thickness
|
6.0-16.0 |
6.0-16.0 |
|
|
