Transistor Line Up
ICs Line Up
Diode Line Up
FET
SOT PKG
TO PKG
SOIC PKG
SOT/SOD Package
Package
SOT-23
SOT-25 /
SC-74A
SOT-26 /
SC-74
SOD-323
Package Out Line
Package size (mm) (LxWxT)
2.9x1.3x0.95
2.9x1.6x1.1
2.9x1.6x1.1
1.7x1.25x0.9
Lead Frame
Material
Alloy42
KFC SH
KFC SH
KFC SH
Thickness (mm)
0.1
0.15
0.15
0.15
Flag size
(mm)
1.0x0.9
Single: 1.4 x 1.0
Dual: 0.8 x 0.7
Single: 1.4 x 1.0
Dual: 0.8 x 0.7
0.6x0.6
Max chip size
(Equipment tolerance:
±50ｧｭ)
0.80x0.8
Single: 1.0 x 0.9
Dual: 0.6 x 0.6
Single: 1.0 x 0.9
Dual: 0.6 x 0.6
0.5x0.5
Max chip thickness
(mm)
0.3
0.35
0.35
0.3
Die chip
technology
Eutectic
Eutectic
Ag epoxy
Eutectic
Ag epoxy
Eutectic
Mold compound
KTMC-1050T
KTMC-1050T
KTMC-1050T
KTMC-1050T
Tin Plating
Composition
Sn:Pb=90:10
Sn:Pb=90:10
Sn:Pb=90:10
Sn:Pb=90:10
Thickness
(ｧｭ)
6.0~16.0ｧｭ
6.0~16.0ｧｭ
6.0~16.0ｧｭ
6.0-16.0ｧｭ
Package
SOT-323 /
SC-70
SOT-343
SOT-353 /
SC-88A
SOT-363 /
SC-88
Package Out Line
Package size (mm) (LxWxT)
2.0x1.25x0.9
2.0x1.25x0.9
2.0x1.25x0.9
2.0x1.25x0.9
Lead Frame
Material
Alloy42
Alloy42
Alloy42
Alloy42
Thickness
(mm)
0.1
0.1
0.1
0.1
Flag size
(mm)
0.6x0.9
0.7x0.7
Single: 0.8 x 1.7
Dual: 0.5 x 0.5
Single: 0.8 x 1.7
Dual: 0.5 x 0.5
Max chip size (mm)
(Equipment tolerance:
±50ｧｭ)
0.5x0.5
0.6x0.6
Single: 0.7 x 0.6
Dual: 0.4 x 0.4
Single: 0.7 x 0.6
Dual: 0.4 x 0.4
Max chip thickness
(mm)
0.25
0.25
0.25
0.25
Die chip technology
Eutectic
Eutectic
Ag epoxy
Eutectic
Ag epoxy
Eutectic
Ag epoxy
Mold compound
KTMC-1050TM
KTMC-1050TM
KTMC-1050TM
KTMC-1050TM
Tin Plating
Composition
Sn:Pb=90:10
Sn:Pb=90:10
Sn:Pb=90:10
Sn:Pb=90:10
Thickness
(ｧｭ)
6.0~16.0ｧｭ
6.0~16.0ｧｭ
6.0~16.0ｧｭ
6.0-16.0ｧｭ
Package
SOT-223
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Package Out Line
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｡｡
Package size(mm) (LxWxT)
6.5x3.5x1.6
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Lead Frame
Material
C194
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｡｡
｡｡
Thickness
(mm)
0.25
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Flag size
(mm)
2.5 x 2.7
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Max chip size(mm)
(Equipment tolerance:
±50ｧｭ)
2.2 x 2.5
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Max chip thickness(mm)
0.40
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Die chip technology
Eutectic
Ag Epoxy
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｡｡
｡｡
Mold compound
KTMC-1051
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｡｡
｡｡
Tin Plating
Composition
Sn:Pb=90:10
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｡｡
｡｡
Thickness
(ｧｭ)
6.0~16.0ｧｭ
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